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China · ShenZhen
Exhibition Center
2018Exhibition time
December 20-22
Exhibition
Countdown
6 Days
Company name (CN) 奥肯思(北京)科技有限公司
Company name (EN)
Main products
Website http://
Booth 2G20
Company Profile
Product Profile
  • SiP及封装全流程设计仿真平台

    相对于传统的设计仿真平台,SiP设计仿真需要具备键合线、腔体、芯片堆叠、RF射频电路、埋入式电阻电容等功能。3D显示功能要求效果好,可在3D环境中进行布局、测量等操作;其仿真工具能够正确建模并仿真键合线、腔体、芯片堆叠等3D立体结构并能够进行快速建模和仿真。
Time
2018,December 20-22
Location
ChinaShenZhenExhibition Center
Organizer
Shenzhen UBM Creativity Exhibition Co., Ltd.
Support and activities unit
China Institute of Communications、The Aliance Etc
China Electronic Components Industry Association
China Semiconductor Industry Association
Shenzhen Medical Device Industry Association
Taiwan Electrical and Electronic Industry Association
TECA Taiwan Electronic Link Industry Association
China Software Industry Association Branch Of Embedded System
Phone
86-755-8831 1535
Fax
86-755-8831 2533
Address
Rm1101, DESAY Building,High-Tech 1st Road South,Yuehai Sub - district,Nanshan District, Shenzhen
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